 The innovative tradition of SyncMAX brings RoHS standard to SyncMAX by using the socket DIMM technology. Socket DIMM differs from the traditional DIMM in the design of the PCB board. Traditionally, DRAM chips are soldered onto a PCB board through the SMT process and the whole module is sent into an oven for stabilization. In socket DIMM, DRAM chips no longer need be soldered onto the PCB. Instead, they are freely dropped into each of the sockets that are originally placed on the PCB. Each socket has a cover to protect the chip from damaged and dislocation.
The innovative tradition of SyncMAX brings RoHS standard to SyncMAX by using the socket DIMM technology. Socket DIMM differs from the traditional DIMM in the design of the PCB board. Traditionally, DRAM chips are soldered onto a PCB board through the SMT process and the whole module is sent into an oven for stabilization. In socket DIMM, DRAM chips no longer need be soldered onto the PCB. Instead, they are freely dropped into each of the sockets that are originally placed on the PCB. Each socket has a cover to protect the chip from damaged and dislocation.
The assembly process of a socket DIMM does not require a SMT process to fix the DRAM chips onto the PCB. The pre-set socket on the PCB allows the DRAM chips to be dropped in one by one and clamped tight with a lid which allows quick heat dissipation.
Tight quality control ensures the quality of the socket DIMM just as the traditional UDIM. All DRAM chips are pre-qualified before assembly using the KingTiger ™ testing technology. Also, each socket DIMM module is fully tested before shipping. The dual quality control continues to ensure top quality DRAM modules being manufactured.
Socket DIMM is identical to the traditional UDIMM in specifications and functions and is compatible to all personal computers and servers. It is in general more thick and heavier than UDIMM because of the sockets.
For samples, please contact our sales.
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